Board level multi-physical system engineer (Cable arrangement) 1HC
Position: Board Level Multi-Physical System Engineer (Cable Arrangement) Location: Grenoble, France Headcount: 1
About the Client: Our client is a global leader in information and communications technology, delivering end-to-end solutions that span carrier networks, enterprise, consumer, and cloud computing fields. Their mission is to create a fully connected, intelligent world by making digital connectivity accessible to everyone. With operations in over 170 countries, the client’s products and solutions impact over a third of the world’s population.
The client’s Grenoble Research Center, established in 2019, focuses on advanced ICT product research and development. The team, comprising 30+ engineers, includes PhDs and industry experts working on board-level engineering, cable management, and multi-physical system simulation. This role is an exciting opportunity to join a team dedicated to innovation in high-speed signal integrity, cable management simulation, and hardware reliability solutions.
Position Overview: We are seeking a Board Level Multi-Physical System Engineer with expertise in one of two main focus areas:
High-Speed Direction: Specialization in 224 Gbit/s high-speed signal modulation, large bandwidth design, high-speed signal protocol layer standards, and physical layer design for high-speed links.
Board-Level Process Reliability Direction: Focus on assembly and reliability of large-sized chips on PCBs, including challenges in chip package/PCB reliability, package substrate warpage, CTE (Coefficient of Thermal Expansion) deformation, and micro-machining and micro-assembly technologies for packaging/PCB.
The successful candidate will contribute to groundbreaking research, collaborate with local and international teams, and drive innovation in cable management and multi-physical modeling.
Key Responsibilities:
Lead research in one of the two main directions (High-Speed or Board-Level Process Reliability), providing technical solutions and insights.
Develop and implement cable management simulation modeling technology, particularly focusing on stress, reliability, and signal integrity for ICT products.
Conduct technology roadmap planning and contribute to the technical development of cable simulation tools and methods.
Collaborate with diverse teams in both local and international settings, preparing specifications and design documents.
Incubate new technologies within cable management and multi-physical system modeling.
Main Requirements:
Educational Background: Master’s degree or PhD preferred, in Electrical Engineering, Mechanical Engineering, Information Technology, or a related field.
Specialization in One of the Two Key Directions:
High-Speed Direction: Strong knowledge in high-speed signal modulation (224 Gbit/s), large bandwidth design, high-speed signal protocol standards (IEEE 400G), and physical layer design for high-speed links.
Board-Level Process Reliability Direction: Expertise in the assembly and reliability of large-sized chips on PCBs, including knowledge of package warpage, thermal expansion, and micro-assembly techniques.
Technical Skills:
Familiarity with multi-scale, multi-physical field simulation tools such as Comsol or IPS, with expertise in governing equations and material properties.
Strong problem-solving abilities, with a collaborative approach to working within a multi-disciplinary team.
Additional Skills: Excellent communication skills, fluency in English, and adaptability to a multicultural work environment.
Preferred Background: Ideal candidates will have industry or research experience from companies like Intel, NVIDIA, Broadcom, IBM, or academia with a focus on high-speed signal modulation or board-level reliability for large-scale hardware.
Candidate Profile:
Passionate about solving technical challenges in next-generation hardware solutions.
Strong analytical thinker, motivated to drive innovation within either high-speed design or process reliability.
Adaptable to a multicultural team environment and willing to collaborate with both local and international teams.
Enthusiastic about sharing knowledge and advancing technical expertise.
Team Environment: The candidate will join a highly skilled and diverse hardware engineering team at the Grenoble Research Center, focused on multi-physical system engineering and next-generation hardware innovation.
Recruitment Process: The recruitment process includes three rounds of interviews.
Career Perspective: As the Grenoble Research Center expands, there may be opportunities for career growth and leadership roles.
Benefits: A highly competitive salary and benefits package.
Keywords: High-Speed Signal Modulation, High-Speed Link Design, 224 Gbit/s Bandwidth, PCB Assembly Reliability, Large Chip Package Warpage, Multi-Physical Simulation
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