Laboratory director 1HC (PCB/board-level/high-speed signal)
Laboratory Director (high-speed data board-level) - R&D (Paris Region, France)
Location: Paris region, France
Reports to: Regional Head of R&D
Employment Type: Full-time
About the Company
Our client is a global leader in information and communications technology (ICT) solutions, known for its customer-centric innovation. The company operates across carrier networks, enterprise solutions, consumer electronics, and cloud computing, with a presence in over 170 countries, serving more than a third of the world's population. The company’s vision is to enhance global digital connectivity, driving an intelligent and connected future. Their Grenoble Research Center specializes in board-level hardware engineering solutions within the ICT space, and is seeking a dynamic leader to guide a growing team of top-tier engineers.
Job Overview
As the Laboratory Director, you will lead a team of R&D experts specializing in high-speed interconnects and component integration at the board level. You will spearhead research initiatives aimed at advancing high-speed signal architecture, improving component reliability, and driving cost-efficient engineering solutions. This role also emphasizes building industry and academic partnerships, enhancing the company’s technological leadership and influence in the local ecosystem.
Key Responsibilities
Technological Innovation: Oversee research on high-speed board-level architecture (112 Gbps+) and ensure reliability in component/module packaging.
Strategic Lab Development: Establish and expand a world-class lab in alignment with the company's strategic goals, leveraging local resources for competitive advantage.
Industry Collaboration: Cultivate partnerships with local tech firms, academic institutions, and industry experts to integrate leading technologies and achieve business goals.
Cross-Disciplinary Leadership: Manage a high-performing, diverse engineering team, deploying strategic resources and fostering collaboration across regions and disciplines.
Platform Development: Enhance the center’s platform capabilities to contribute to both local and global R&D efforts, delivering state-of-the-art technologies.
CSR and Talent Pipeline: Establish a talent pipeline by collaborating with academic institutions, creating internships, and developing talent in line with the company’s CSR initiatives.
Cross-Cultural Communication: Promote the company’s core values and technical strategies across diverse teams, ensuring effective cross-cultural collaboration.
Requirements
Experience:
10+ years of experience in high-speed signal architecture or multi-physics simulation.
Proven expertise in board-level or complex module design for high-speed signals (112 Gbps+).
Demonstrated experience managing projects from technical, commercial, and legal perspectives.
Technical Skills:
Expertise in high-speed signal modulation, high-bandwidth design, and multi-physics simulation modeling.
Knowledge of reliability engineering at the board/module level, including package substrate reliability and PCB assembly.
Familiarity with standards like IEEE 400G KR, CR, PCI-E Gen 7, and protocols such as high-speed SerDes, DFE, and MLSE.
Leadership:
Strong leadership with a proven ability to manage diverse and cross-functional teams.
Ability to align technology development with the company’s global strategy, leveraging local trends and resources.
Communication:
Fluent in English (spoken and written), with experience leading cross-cultural teams.
Networking:
Established network within academic and industrial ICT communities.
Desired Candidate Profile
Leadership: A natural leader with experience building high-performance engineering teams.
Technologically Driven: Passionate about cutting-edge innovations in ICT and engineering.
Problem-Solver: Adept at resolving complex technical challenges.
Strategic Visionary: Skilled in identifying and leveraging local competitive advantages.
Culturally Adaptive: Comfortable in diverse, cross-cultural work environments.
Benefits
Competitive salary package with performance-based bonuses.
Opportunities for career advancement within the global R&D framework.
Collaborative, innovative environment with industry-leading professionals.
Keywords:
High-Speed Signal Modulation, PAM Modulation, High-Speed SerDes, IEEE 400G, PCI-E Gen 7, 112Gbps/56Gbps/224Gbps, High-Speed DFE, CTLE, MLSE, Channel Calibration.
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