Laboratory director 1HC (PCB/board-level/high-speed signal)

Location:France - Grenoble/Paris
Job description:

Laboratory Director (high-speed data board-level) - R&D (Paris Region, France)

Location: Paris region, France

Reports to: Regional Head of R&D

Employment Type: Full-time

About the Company

Our client is a global leader in information and communications technology (ICT) solutions, known for its customer-centric innovation. The company operates across carrier networks, enterprise solutions, consumer electronics, and cloud computing, with a presence in over 170 countries, serving more than a third of the world's population. The company’s vision is to enhance global digital connectivity, driving an intelligent and connected future. Their Grenoble Research Center specializes in board-level hardware engineering solutions within the ICT space, and is seeking a dynamic leader to guide a growing team of top-tier engineers.

Job Overview

As the Laboratory Director, you will lead a team of R&D experts specializing in high-speed interconnects and component integration at the board level. You will spearhead research initiatives aimed at advancing high-speed signal architecture, improving component reliability, and driving cost-efficient engineering solutions. This role also emphasizes building industry and academic partnerships, enhancing the company’s technological leadership and influence in the local ecosystem.

Key Responsibilities

  • Technological Innovation: Oversee research on high-speed board-level architecture (112 Gbps+) and ensure reliability in component/module packaging.

  • Strategic Lab Development: Establish and expand a world-class lab in alignment with the company's strategic goals, leveraging local resources for competitive advantage.

  • Industry Collaboration: Cultivate partnerships with local tech firms, academic institutions, and industry experts to integrate leading technologies and achieve business goals.

  • Cross-Disciplinary Leadership: Manage a high-performing, diverse engineering team, deploying strategic resources and fostering collaboration across regions and disciplines.

  • Platform Development: Enhance the center’s platform capabilities to contribute to both local and global R&D efforts, delivering state-of-the-art technologies.

  • CSR and Talent Pipeline: Establish a talent pipeline by collaborating with academic institutions, creating internships, and developing talent in line with the company’s CSR initiatives.

  • Cross-Cultural Communication: Promote the company’s core values and technical strategies across diverse teams, ensuring effective cross-cultural collaboration.

Requirements

Experience:

  • 10+ years of experience in high-speed signal architecture or multi-physics simulation.

  • Proven expertise in board-level or complex module design for high-speed signals (112 Gbps+).

  • Demonstrated experience managing projects from technical, commercial, and legal perspectives.

Technical Skills:

  • Expertise in high-speed signal modulation, high-bandwidth design, and multi-physics simulation modeling.

  • Knowledge of reliability engineering at the board/module level, including package substrate reliability and PCB assembly.

  • Familiarity with standards like IEEE 400G KR, CR, PCI-E Gen 7, and protocols such as high-speed SerDes, DFE, and MLSE.

Leadership:

  • Strong leadership with a proven ability to manage diverse and cross-functional teams.

  • Ability to align technology development with the company’s global strategy, leveraging local trends and resources.

Communication:

  • Fluent in English (spoken and written), with experience leading cross-cultural teams.

Networking:

  • Established network within academic and industrial ICT communities.

Desired Candidate Profile

  • Leadership: A natural leader with experience building high-performance engineering teams.

  • Technologically Driven: Passionate about cutting-edge innovations in ICT and engineering.

  • Problem-Solver: Adept at resolving complex technical challenges.

  • Strategic Visionary: Skilled in identifying and leveraging local competitive advantages.

  • Culturally Adaptive: Comfortable in diverse, cross-cultural work environments.

Benefits

  • Competitive salary package with performance-based bonuses.

  • Opportunities for career advancement within the global R&D framework.

  • Collaborative, innovative environment with industry-leading professionals.

Keywords:

High-Speed Signal Modulation, PAM Modulation, High-Speed SerDes, IEEE 400G, PCI-E Gen 7, 112Gbps/56Gbps/224Gbps, High-Speed DFE, CTLE, MLSE, Channel Calibration.

Apply for this job
Upload CV to autofill application
Read our Privacy policyPowered by Adaptive ATS