Laboratory director 1HC (PCB/board-level/high-speed signal)

Job Title: Laboratory Director (High-Speed Data Board-Level) - R&D

Location: Paris Region, France Reports to: Regional Head of R&D Employment Type: Full-Time

About the Company

Our client is a global leader in information and communications technology (ICT) solutions, renowned for its commitment to customer-focused innovation. Operating in carrier networks, enterprise solutions, consumer electronics, and cloud computing, the company serves over a third of the world's population across 170+ countries. With a strong vision of a digitally connected future, they aim to drive intelligent, connected solutions worldwide. Their Research Center in the Grenoble region focuses on board-level hardware engineering within the ICT sector and is now seeking a forward-thinking Laboratory Director to lead a high-performing team of engineers.

Job Overview

As the Laboratory Director, you will lead a team of R&D specialists dedicated to high-speed interconnect and board-level component integration. Your primary responsibilities will include advancing high-speed signal architecture, ensuring component reliability, and developing cost-effective engineering solutions. This strategic role also involves building partnerships with academia and industry to reinforce the company’s leadership in the local ecosystem.

Key Responsibilities

• Technological Innovation:

  • Oversee high-speed board-level architecture R&D (112 Gbps+) and ensure reliability across component/module packaging.

  • Drive research and implementation for advanced high-speed signal modulation (224 Gbps), protocol layer standards, and high-speed link design.

• Strategic Lab Development:

  • Build and expand a world-class lab aligned with company goals, leveraging local resources for competitive advantage.

• Industry Collaboration:

  • Establish partnerships with local technology firms, universities, and industry experts to integrate leading-edge technologies and meet business objectives.

• Cross-Disciplinary Leadership:

  • Lead a diverse engineering team, strategically deploying resources and fostering collaboration across regions and specialties.

• Platform Development:

  • Enhance the lab’s capabilities to contribute to both local and global R&D efforts, delivering cutting-edge technologies for high-speed connectivity solutions.

• CSR and Talent Pipeline:

  • Collaborate with academic institutions to create a talent pipeline, including internships, and develop skills aligned with corporate social responsibility (CSR) goals.

• Cross-Cultural Communication:

  • Advocate for the company’s values and strategies, ensuring effective cross-cultural collaboration within and beyond the lab.

Requirements

Experience:

• 10+ years in high-speed signal architecture or multi-physics simulation.

• Proven expertise in board-level or complex module design for high-speed signals (112 Gbps+).

• Experience managing projects from technical, commercial, and legal standpoints.

Technical Skills:

• Expertise in high-speed signal modulation, high-bandwidth design, and multi-physics simulation.

• Strong understanding of reliability engineering for board-level and module-level assemblies, including substrate reliability and PCB assembly.

• Familiarity with industry standards such as IEEE 400G KR, CR, PCI-E Gen 7, and protocols like high-speed SerDes, DFE, and MLSE.

Leadership:

• Demonstrated ability to lead diverse, cross-functional engineering teams.

• Proven capacity to align technology development with global strategy while leveraging local trends and resources.

Communication:

• Fluent in English (spoken and written) with experience leading cross-cultural teams.

Networking:

• Established connections within the academic and industrial ICT communities.

Desired Candidate Profile

• Leadership: A natural leader with experience in building and managing high-performance engineering teams.

• Technologically Driven: Passionate about innovative advancements in ICT and engineering.

• Problem-Solver: Skilled at resolving complex technical challenges.

• Strategic Visionary: Able to identify and capitalize on local competitive advantages.

• Culturally Adaptive: Comfortable working in a diverse, cross-cultural environment.

Benefits

• Competitive salary package with performance-based bonuses.

• Career advancement opportunities within a global R&D framework.

• Collaborative and innovative work environment with industry-leading professionals.

Keywords

High-Speed Signal Modulation, PAM Modulation, High-Speed SerDes, IEEE 400G, PCI-E Gen 7, 112Gbps/56Gbps/224Gbps, High-Speed DFE, CTLE, MLSE, Channel Calibration